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SANTA CLARA, Calif.–(BUSINESS WIRE)–TSMC (TWSE: 2330, NYSE: TSM) right this moment showcased the latest improvements in its superior logic, specialty, and 3D IC applied sciences on the Firm’s 2022 North America Know-how Symposium, with the next-generation modern N2 course of powered by nanosheet transistors and the distinctive FinFlex™ know-how for the N3 and N3E processes making their debut.
Resuming as an in-person occasion after being held on-line previously two years, the North America symposium in Santa Clara, California, kicks off a sequence of Know-how Symposiums all over the world within the coming months. The Symposiums additionally characteristic an Innovation Zone that spotlights the achievements of TSMC’s rising start-up prospects.
“We live in a quickly altering, supercharged, digital world the place demand for computational energy and power effectivity is rising quicker than ever earlier than, creating unprecedented alternatives and challenges for the semiconductor {industry},” mentioned Dr. C.C. Wei, CEO of TSMC. “The improvements we’ll showcase at our Know-how Symposiums show TSMC’s know-how management and our dedication to help our prospects by means of this thrilling interval of transformation and progress.”
Main applied sciences highlighted on the Symposium embody:
TSMC FinFlex™ for N3 and N3E – TSMC’s industry-leading N3 know-how, set to enter quantity manufacturing later in 2022, will characteristic the revolutionary TSMC FinFlex™ architectural innovation providing unparalleled flexibility for designers. The TSMC FinFlex™ innovation presents selections of various commonplace cells with a 3-2 fin configuration for extremely efficiency, a 2-1 fin configuration for greatest energy effectivity and transistor density, and a 2-2 fin configuration offering a stability between the 2 for Environment friendly Efficiency. With TSMC FinFlex™ structure, prospects can create system-on-chip designs exactly tuned for his or her wants with practical blocks implementing one of the best optimized fin configuration for the specified efficiency, energy and space goal, and built-in on the identical chip. For extra data on FinFlex, please go to N3.TSMC.COM.
N2 Know-how – TSMC’s N2 know-how represents one other exceptional development over N3, with 10-15% velocity enchancment on the identical energy, or 25-30% energy discount on the identical velocity, ushering in a brand new period of Environment friendly Efficiency. N2 will characteristic nanosheet transistor structure to ship a full-node enchancment in efficiency and energy effectivity to allow next-generation product improvements from TSMC prospects. The N2 know-how platform features a high-performance variant along with the cellular compute baseline model, in addition to complete chiplet integration options. N2 is scheduled to start manufacturing in 2025.
Increasing Extremely -Low Energy Platform – Constructing on the success of the N12e know-how introduced on the 2020 Know-how Symposium, TSMC is creating N6e, the subsequent evolution in course of know-how tuned to offer the computing energy and power effectivity required by edge AI and IoT gadgets. N6e can be based mostly on TSMC’s superior 7nm course of and is anticipated to have thrice larger logic density than N12e. It’ll function part of TSMC’s Extremely-Low Energy platform, a complete portfolio of logic, RF, analog, embedded nonvolatile reminiscence, and energy administration IC options aimed toward purposes in edge AI and the Web of Issues.
TSMC 3DFabric™ 3D Silicon Stacking Options – TSMC is showcasing two groundbreaking buyer purposes of the TSMC-SoIC™ chip stacking answer:
- The world’s first SoIC-based CPU using Chip-on-Wafer (CoW) know-how to stack SRAM as a Stage 3 cache
- A groundbreaking intelligence processing unit stacked on prime of a deep trench capacitor die utilizing Wafer-on-Wafer (WoW) know-how.
With N7 chips already in manufacturing for each CoW and WoW, help for N5 know-how is scheduled for 2023. To satisfy buyer demand for SoIC and different TSMC 3DFabric™ system integration providers, the world’s first totally automated 3DFabric manufacturing unit is ready to start manufacturing within the second half of 2022.
About TSMC
TSMC pioneered the pure-play foundry enterprise mannequin when it was based in 1987, and has been the world’s main devoted semiconductor foundry ever since. The Firm helps a thriving ecosystem of world prospects and companions with the {industry}’s main course of applied sciences and portfolio of design enablement options to unleash innovation for the worldwide semiconductor {industry}. With world operations spanning Asia, Europe, and North America, TSMC serves as a dedicated company citizen all over the world.
TSMC deployed 291 distinct course of applied sciences, and manufactured 12,302 merchandise for 535 prospects in 2021 by offering broadest vary of superior, specialty and superior packaging know-how providers. TSMC is the primary foundry to offer 5-nanometer manufacturing capabilities, probably the most superior semiconductor course of know-how accessible on the planet. The Firm is headquartered in Hsinchu, Taiwan. For extra data please go to https://www.tsmc.com.
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